ASTM B861-06 A Electronic Titanium Tube Target

133OD*125ID*2940L Include Flange Titanium Tube Target Titanium Gr2 ASTM B861-06 a The Target Material Vacuum Coating

The development trend of target material technology is closely related to the development trend of thin film technology in downstream industries. With the technological improvement of applied industries in thin film products or components, target technology should also be changed. In all application industries, semiconductor industry requires the most stringent quality requirements for target sputtering films. Now the 12 inch (300) silicon wafer has been manufactured, and the width of the interconnect is decreasing. Silicon wafer manufacturers require large size, high purity, low segregation and fine grain for the target, which requires that the target material has better microstructure. The diameter and uniformity of crystal particles have been considered as the key factors affecting the deposition rate of films. Flat panel display (FPD) has been in the market for computer monitors and TV sets dominated by cathode ray tubes (CRT) over the years. It will also drive the technology and market demand of ITO targets. Nowadays, there are two kinds of iTO targets. One is the sintering of nano indium oxide and tin oxide powder, the other is indium tin alloy target. The ITO thin films can be produced by DC reactive sputtering, but the target surface will oxidize and affect the sputtering rate, and it is not easy to obtain large-sized gold target. In terms of storage technology, the development of high-density and large capacity hard disk requires a large amount of giant magnetoresistance film material. CoF~Cu multilayer composite film is widely used in giant magnetoresistance thin film structures nowadays.

Main advantages
Low density high specification strength
Custom request customization
Excellent corrosion resistance
Good heat resistance
Excellent low temperature performance
Good thermal properties
Low elastic modulus